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Vishay Intertechnology, Inc. announced a new thin film submount platform aimed at next-generation optical transceivers, RF modules, and advanced electronic packaging applications that require high thermal performance, precision alignment, and high frequency signal integrity.
Vishay said the platform builds on its thin film substrate capabilities, using precision deposition of passive circuit elements and precision machining of advanced ceramic substrates, including aluminum nitride (AlN). The company said this combination supports superior thermal conductivity, dimensional stability, and electrical performance in demanding environments.
The platform is optimized for high speed data communications, including 800G, 1.6T, and 3.2T optical transceivers. Vishay said these applications face increasing power densities and tighter packaging constraints, which require improved heat dissipation, more difficult alignment, and low loss interconnect performance. The company said its thin film submounts help designers improve thermal management at the device level while maintaining precision alignment and signal integrity at high frequencies.
“Next-generation photonics and RF systems push the limits of thermal, mechanical, and electrical performance at the package level,” said Michael Casper, vice president of specialty thin film at Vishay. “Our thin film submount platform provides engineers with a flexible solution that enables high performance without compromising reliability.”
Vishay said the thin film submount platform is proven across applications including laser diode mounting, RF/microwave modules, optical alignment, combined wire bond and SMT processes, and hermetic packaging solutions. The company also said it works with customers in defense, space, and high reliability industrial applications to develop designs meeting stringent performance and environmental requirements.
Vishay said it can provide samples and support custom designs now, supported by its global production capabilities.
Vishay manufactures one of the world’s largest portfolios of discrete semiconductors and passive electronic components used in automotive, industrial, computing, consumer, telecommunications, military, aerospace, and medical markets. The company serves customers worldwide and is a Fortune 1000 company listed on the NYSE (VSH).
Vishay Intertechnology: Peter Henrici, +1 408 567-8400, peter.henrici@vishay.com
Redpines: Bob Decker, +1 415 409-0233, bob.decker@redpinesgroup.com
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